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Production Technologies

We maintain state-of-the-art facilities and equipment to supply the following technologies:

  • SMT assembly
  • THT assembly
  • Convection reflow
  • Vapour phase reflow
  • Selective soldering
  • Protective coatings for PCBs
  • PCB encapsulation

Our highly modern and fully automatic SMD assembly lines are equipped with an array of Siemens pick-and-place machines. These machines reflect state-of-the-art technology and guarantee fast, precise production of your SMD assemblies.

Manufacturing capacity, SMT assembly:

Maximum output 1,500 million assemblies p.a.
Minimum assembly dimensions Type 0201
Maximum assembly dimensions 55 mm²
Fine pitch placement To 0.3 mm
Circuit board dimensions Max. 610 mm x 460 mm
Reflow Vapour phase reflow, convection reflow

All fully automated reflow processes are performed in a controlled nitrogen atmosphere (protective gas) and are available as leaded and unleaded processes.

Manufacturing capacity, THT assembly:

Maximum assembly output 80 million assemblies p.a.
Automated assembly preparation  
Semi-automatic assembly with laser assembly benches  
Double wave soldering  
Selective soldering  
Board dimensions max. 650 mm x 450/500 mm

All fully automated reflow processes are performed in a controlled nitrogen atmosphere (protective gas) and are available as leaded and unleaded processes.